PRODUCT Semiconductor Chemical Monitor

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• ProductsSemiconductor Chemical Monitor Copper Plating Additive Analysis
  Copper Plating Additive Analysis

  CRUX supports copper electroplating systems for RDL and TSV by rapidly analyzing the bath’s critical chemistry. Using FECA-based measurement, CRUX can quantify (1) Brightener, (2) Suppressor, (3) Leveler, and (4) Copper ions within minutes. This fast, data-driven monitoring helps maintain stable deposition performance, improves thickness/uniformity control, and reduces process drift in advanced packaging production.

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