PRODUCT Semiconductor Chemical Monitor

• 
  • 
• ProductsSemiconductor Chemical Monitor Tin/Silver Plating Additive Analysis
  Tin/Silver Plating Additive Analysis

  CRUX supports Tin–Silver electroplating systems for micro-bump manufacturing with fast, quantitative bath monitoring. It can detect five critical components—(1) Grain Refiner, (2) Methanesulfonic Acid, (3) Silver Complex Agent, (4) Divalent Tin (Sn²⁺), and (5) Total Tin—and complete the analysis in about 5 minutes. This rapid feedback helps keep chemistry within spec and improves process stability for consistent micro-bump quality.

  Back